THERMAL PROFILING SOLUTIONS
What are the application areas for the DataPaq temperature logger?
1. Heat treatment processes (metals, alloys)
Temperature profiling in furnaces: measurement of core and surface temperatures throughout the process (heating, holding, cooling).
Vacuum, atmospheric, or gas-controlled environments for carburizing, nitriding, annealing, tempering, and hardening.
Temperature uniformity checks (TUS) to verify that furnace consistency is within tolerances.
Thermal cycling during sintering or diffusion bonding.
2. Coating, paint, and powder processing
Curing (hardening) of coatings, lacquers, or powder coatings, requiring close temperature monitoring. Heating furnaces for automotive or component production (e.g., bodywork, components) where temperature profiles are strictly defined.
Electrophoretic coating processes, preheating, and drying. 3. Glass Production and Finishing
Temperature profiles in glass tempering furnaces, tempering, and bending processes.
Stress monitoring in glass during heating/cooling.
4. Ceramics, ceramic processes, and refractory applications
Firing furnaces, sintering processes, ceramic manufacturing.
Temperature profiling in process cycles reaching high temperatures.
5. Electronics and Soldering Processes
Profiling of reflow and soldering processes on printed circuit boards.
Validation of temperature profiles at the component level.
6. Food and Pharmaceutical Processes (heat treatment, drying, sterilization)
Temperature monitoring in furnaces or drying tunnels. Validation of sterilization cycles (if the sensor's scope of application is compatible with the process).
THERMAL PROFILING SOLUTIONS
What are the application areas for the DataPaq temperature logger?
1. Heat treatment processes (metals, alloys)
Temperature profiling in furnaces: measurement of core and surface temperatures throughout the process (heating, holding, cooling).
Vacuum, atmospheric, or gas-controlled environments for carburizing, nitriding, annealing, tempering, and hardening.
Temperature uniformity checks (TUS) to verify that furnace consistency is within tolerances.
Thermal cycling during sintering or diffusion bonding.
2. Coating, paint, and powder processing
Curing (hardening) of coatings, lacquers, or powder coatings, requiring close temperature monitoring. Heating furnaces for automotive or component production (e.g., bodywork, components) where temperature profiles are strictly defined.
Electrophoretic coating processes, preheating, and drying. 3. Glass Production and Finishing
Temperature profiles in glass tempering furnaces, tempering, and bending processes.
Stress monitoring in glass during heating/cooling.
4. Ceramics, ceramic processes, and refractory applications
Firing furnaces, sintering processes, ceramic manufacturing.
Temperature profiling in process cycles reaching high temperatures.
5. Electronics and Soldering Processes
Profiling of reflow and soldering processes on printed circuit boards.
Validation of temperature profiles at the component level.
6. Food and Pharmaceutical Processes (heat treatment, drying, sterilization)
Temperature monitoring in furnaces or drying tunnels. Validation of sterilization cycles (if the sensor's scope of application is compatible with the process).
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