PROFILING

Tempco - Appareils en location

PROFILING 

THERMAL PROFILING SOLUTIONS

What are the application areas for the DataPaq temperature logger?

1. Heat treatment processes (metals, alloys)
Temperature profiling in furnaces: measurement of core and surface temperatures throughout the process (heating, holding, cooling).
Vacuum, atmospheric, or gas-controlled environments for carburizing, nitriding, annealing, tempering, and hardening.
Temperature uniformity checks (TUS) to verify that furnace consistency is within tolerances.
Thermal cycling during sintering or diffusion bonding.

2. Coating, paint, and powder processing
Curing (hardening) of coatings, lacquers, or powder coatings, requiring close temperature monitoring. Heating furnaces for automotive or component production (e.g., bodywork, components) where temperature profiles are strictly defined.
Electrophoretic coating processes, preheating, and drying. 3. Glass Production and Finishing
Temperature profiles in glass tempering furnaces, tempering, and bending processes.
Stress monitoring in glass during heating/cooling.

4. Ceramics, ceramic processes, and refractory applications
Firing furnaces, sintering processes, ceramic manufacturing.
Temperature profiling in process cycles reaching high temperatures.

5. Electronics and Soldering Processes
Profiling of reflow and soldering processes on printed circuit boards.
Validation of temperature profiles at the component level.

6. Food and Pharmaceutical Processes (heat treatment, drying, sterilization)
Temperature monitoring in furnaces or drying tunnels. Validation of sterilization cycles (if the sensor's scope of application is compatible with the process).
THERMAL PROFILING SOLUTIONS

What are the application areas for the DataPaq temperature logger?

1. Heat treatment processes (metals, alloys)
Temperature profiling in furnaces: measurement of core and surface temperatures throughout the process (heating, holding, cooling).
Vacuum, atmospheric, or gas-controlled environments for carburizing, nitriding, annealing, tempering, and hardening.
Temperature uniformity checks (TUS) to verify that furnace consistency is within tolerances.
Thermal cycling during sintering or diffusion bonding.

2. Coating, paint, and powder processing
Curing (hardening) of coatings, lacquers, or powder coatings, requiring close temperature monitoring. Heating furnaces for automotive or component production (e.g., bodywork, components) where temperature profiles are strictly defined.
Electrophoretic coating processes, preheating, and drying. 3. Glass Production and Finishing
Temperature profiles in glass tempering furnaces, tempering, and bending processes.
Stress monitoring in glass during heating/cooling.

4. Ceramics, ceramic processes, and refractory applications
Firing furnaces, sintering processes, ceramic manufacturing.
Temperature profiling in process cycles reaching high temperatures.

5. Electronics and Soldering Processes
Profiling of reflow and soldering processes on printed circuit boards.
Validation of temperature profiles at the component level.

6. Food and Pharmaceutical Processes (heat treatment, drying, sterilization)
Temperature monitoring in furnaces or drying tunnels. Validation of sterilization cycles (if the sensor's scope of application is compatible with the process).
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Showing 1 - 6 of 6 items
  • Comprehensive thermal profiles for applications such as powder coating, paint curing, component supply and OEM general paint, powder paint and e-coat paint applications up to 400°C.

  • Designed for the long process durations typical in the ceramics industry, the Datapaq Kiln Tracker System enables you to get accurate in-process product core and surface temperature profiles from within the product passing through the kilns in real time.

  • Designed for the metallurgical industries, for the most robust and sophisticated furnace profiling systems.

  • Designed specifically for photovoltaic (PV) manufacturing, including applications such as contact fusing, contact drying, solar cell anti-reflective coating, lamination and other thin film processes.

  • Temperature monitoring of all wave soldering applications – including wave, reflow, vapor, selective or rework soldering stations – in real time. Ideal for electronic production and semiconductor applications

  • Designed to measure and record accurate product and environment temperatures and provide reliable and accurate HACCP process validation. It is the ideal solution for demanding food processing applications.

Showing 1 - 6 of 6 items